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氮化镓快充
得益于氮化镓材料本身优异的性能，使得做出来的氮化镓比传统硅基IGBT/MOSFET 等芯片面积更小，同时由于更耐高压，大电流，氮化镓芯片功率密度更大，因此功率密度/面积远超硅基，此外由于使用氮化镓芯片后还减少了周边的其他元件的使用，电容，电感，线圈等被动件比硅基方案少的多，进一步缩小的体积，所以本次看到的氮化镓快充头，不仅体积小巧，但是还能提供更强大的功率输出。
2021-01-14
高速分立器件测试机（600V/5A）销售
通过高速测量系统和高通量实现高速产出能力 为客户节省测试系统的成本做出贡献。
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晶圆测试及测试程式开发
合理运用厂内现有无尘车间并计划在2021年Q2为中小型设计公司提供晶圆工程片测试，2021年Q3实现正式晶圆测试量产，测试程序开发等半导体后段加工服务，搭建成熟的工程团队提供更有成本效益的解决方案满足客户需求
2021-01-14
专用烤箱代理-压力烤箱
压力烤箱
2021-01-14
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