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晶圆测试及测试程式开发
release time
2021-01-14
source
科瑞恩
Pageviews
586
合理运用厂内现有无尘车间并计划在2021年Q2为中小型设计公司提供晶圆工程片测试，2021年Q3实现正式晶圆测试量产，测试程序开发等半导体后段加工服务，搭建成熟的工程团队提供更有成本效益的解决方案满足客户需求
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